Packaging & Testing

  • Packaging & Testing

Chizhou Hisemi Electronic Technology Co., LTD. Packaging business mainly LGA, QFN, DFN, SOP, SOT, TO, LQFP series, a total of more than 100 varieties. Since its establishment, the company has always focused on the integrated circuit packaging and testing field, adhering to the core of technological innovation, has master multi-chip module (MCM) package, THREE-DIMENSIONAL (3D) stack core package, miniaturized flat pin less (QFN/DFN) package, high-density micro-spacing integrated circuit package and other core technologies. It has a strong competitive strength in the field of IC packaging and testing.

IC Package Process:

Copper wire, palladium copper wire process ability
Machine:KS RAPID、KS Iconn LA、KS connx elite、ASM Aero、ASM Eagle Xtreme、ihawk Xtreme/GOCU、ASM Eagle60/ihawk

Wire diameter
Min welding area size
Min welding area spacing
Min aluminum layer thickness
Balls Min aluminum layer thickness
Welding line length
18um/0.7mil
50×50um
60um
0.8um
0.8um
0.1~8mm
20um/0.8mil
55×55um
60um
0.8um
0.8um
0.1~8mm
25um/1.0mil
70×70um
75um
1.2um
1.2um
0.1~8mm
30um/1.2mil
85×85um
90um
2.0um
2.0um
0.1~8mm
38um/1.5mil
104×104um
115um
3.0um
3.0um
0.1~8mm
42um/1.7mil
115×115um
125um
4.0um
4.0um
0.1~8mm

Gold wire, alloy wire process ability
Machine:KS RAPID、KS Iconn LA、KS connx elite、ASM Aero、ASM Eagle Xtreme、ihawk Xtreme/GOCU、ASM Eagle60/ihawk

Wire diameter
Min welding area size
Min welding area spacing
Min aluminum layer thickness
Balls Min aluminum layer thickness
Welding line length
18um/0.7mil
48×48um
60um
0.6um
0.6um
0.1~8mm
20um/0.8mil
50×50um
60um
0.8um
0.8um
0.1~8mm
25um/1.0mil
65×65um
75um
0.8um
0.8um
0.1~8mm
30um/1.2mil
78×78um
90um
1.0um
1.0um
0.1~8mm
38um/1.5mil
104×104um
115um
2.0um
2.0um
0.1~8mm
42um/1.7mil
115×115um
130um
2.0um
2.0um
0.1~8mm