Company News

HISEMI Electronics · Won the “Science and Technology Innovation Enterprise Potential Award”

On the afternoon of December 20, the Anhui new energy automobile industry chain Matching meeting hosted by Anhui Provincial Development and Reform Commission (Anhui Provincial New energy Automobile Industry Cluster Construction Work Leading Group Office) was successfully held in Hefei, Anhui province. In his speech at the meeting, Governor Wang Qingxian pointed out that the …

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Consolidating Breakthrough, Casting Strength, and Joining the Core – Core Management Team Building and Expansion Activities

On December 2, 2023, the team building and expansion activity for core management personnel of the company was held as scheduled. A set of warm-up games at the beginning of the activity quickly brought colleagues closer together. At the same time, the chairman of the company, Peng Yong, gave a mobilization speech for this event: …

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The company participated in ICCAD2023 and made a keynote report

On November 10-11, the 29th China Integrated Circuit Design Industry 2023 Annual Conference and Guangzhou Integrated Circuit Industry Innovation and Development Summit Forum (ICCAD 2023) was successfully held at Guangzhou Poly World Trade Center Expo, and the Guangzhou debut of ICCAD came to a successful conclusion With the theme of “Bay Area with You, Core …

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The chairman was invited to attend the CASPA 2023 annual conference banquet

On October 8, Beijing time, the annual meeting of Huamei Semiconductor Association (CASPA) was held as scheduled. The scale of the semiconductor annual meeting is unprecedented, and all kinds of big coffee gathered in Silicon Valley to celebrate the feast. Peng Yong, chairman of the company, was invited to attend the meeting to listen to …

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Huayu Electronics appeared at the ICS2023 Summit and delivered a keynote speech

The 2023 China (Shenzhen) Integrated Circuit Summit (hereinafter referred to as the ICS2023 Summit) was successfully held at the JW Marriott Hotel in Baoan, Shenzhen from September 21 to 22, 2023. Chizhou Huayu Electronics appeared at the conference site and gave a keynote speech. With the theme of “Insight into Core Trends, Building the Core …

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Chizhou Huayu Electronics 2022 Annual Work Report and 2023 Annual Work Plan Arrangement Meeting – Quality oriented and loyal to customers

The sun and the moon are at their best. On February 4, Chizhou Huayu Electronics’ 2022 annual report and 2023 annual work plan arrangement meeting was successfully held. With the theme of “quality oriented and loyal to customers”, the conference comprehensively reviewed and summarized the work in 2022, laid out the development plan in 2023, …

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Warm congratulations: Chizhou Huayu Electronics 8# plant started construction!

People come early in spring, and the year of the rabbit runs forward. Today is the eighth day of the first lunar month, the day of auspiciousness, Chizhou Huayu Electronics 8# plant groundbreaking ceremony was successfully held. The deafening sound of firecrackers, dazzling salutes and cheers on the scene reflect the prosperous, festive and lively …

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Chizhou Huayu electronic packaging and testing product specifications quick overview

Chizhou Huayu sealing and testing ability Chizhou Huayu Electronics has mass-produced as many as 120 kinds of packaging varieties, more than 30 kinds of finished product test solutions, in 2022, the company will add three-temperature Prober: TSK UF3000EX-e automatic wafer probe station, three-temperature Handler: HT-1028C test sorting machine, 3D Vision inspection appearance inspection machine and …

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华宇集团2022年经营分析暨2023年经营计划大会圆满召开!

一元复始,万象更新,千帆过尽,向“芯”而行,回首2022,意义非凡,展望2023,充满希望。 1月9日上午,华宇集团2022年经营分析暨2023年经营计划大会如期召开。会议设池州华宇电子主会场与深圳宝安、深圳福保、无锡、合肥四个分会场。集团董事长、各子公司负责人、高管及员工代表60余人参加了会议。会议由集团董事长彭勇主持。 会上,各子公司负责人依次对2022年的工作经营以及2023年的发展方向做了深层次的分析与汇报,表示未来我们要更加切实的服务好现有客户,紧跟市场动向,向高端市场迈进,要在汽车电子芯片上领域开疆扩土,挖掘更多优质客户。 董事长彭勇就汇报内容做了充分的肯定,并给予高度的认可。他表示过去的一年,是华宇创业发展以来最不平凡的一年。从年初深圳疫情爆发,到年中无锡,合肥疫情发生,再到年底池州疫情,华宇在四个城市五家工厂疫情静默管理期间,大家以身作责,带领职工驻厂,克服困难,为客户赶货,赢得客户信任。诠释了天道酬勤,厚德载物。 新的一年,我们要从以下方面抓高质量发展,抓业绩,抓投资,改善员工福利。 一、 以总经理为首的全面质量管理体系建设:利用利用系统和体系管理流程,推动企业高质量发展; 二、内控制度要再完善:从五个工厂全面实施优化企业经营管理制度与规范落实,让公司经营更顺,所有工作人员轻装上阵,责权利更清晰。 三、 大力创新与技术改造:提升芯片测试领域高端装备更新,车规级芯片成品与晶圆三温测试,12英寸大尺寸晶圆测试能力都需要大幅提升。在封装方面LGA、QFN、LQFP高脚位,BGA、FCBGA、FANOUT工艺需要积极研发投入与人才储备。大力对现有旧装备与工艺进行技术改造,确保技术、品质、效率符合当前市场竞争力。 四、 以质为本,忠于客户:2023年我们需要开拓一批优质客户,市场部要围绕高端封装系列产品开展揭榜挂帅行动,以市场牵头,触发研发导入,生产规模化。 五、 供应链合作能力提升:维绕SCM管理体系,以QCDS为管理基本法则,重点支持优质供应商,重点建立战略合作伙伴。 六、 员工福利提升:要始终做好引进人才,用好人才,留住人才,成就人才。完善华宇电子人力资源制度,让公司好口碑口口相传,每位同事做好对外形象的第一责任人。

华宇电子与您相约 厦门ICCAD 2022

 12月26日,“中国集成电路设计业2022年会暨厦门集成电路产业创新发展高峰论坛(ICCAD 2022)”在厦门国际会展中心拉开帷幕。   华宇电子立足半导体封测产业链,用心深耕,形成了具有华宇特色的封测产业链,展台上吸引了众多客户及供应商驻足探讨! 在ICCAD 12月27日举办的先进封装与测试论坛上,池州华宇电子科技股份有限公司董事长彭勇以《探索集成电路先进封装发展新趋势》为题做了演讲,以先进封装现阶段的发展趋势以及华宇电子在先进封装领域取得的成果,华宇电子可为客户提供一站式、多元化、就近化、一体化的封装测试解决方案,为客户创造价值。