Chizhou HISEMI Electronics phase III IC packaging base project started !
At 9:28 on The morning of December 15, Chizhou HISEMI Electronic Technology Co., LTD. Phase III project was held. The total investment of the third phase project is 1 billion yuan, with a total construction area of 45,000 square meters. After the project reaches the stage, the annual sales will reach 2.5 billion yuan, making the company step into the ranks of advanced packaging in a real sense. The packaging technology will upgrade to SIP system-level 3D packaging technology, LGA