HISEMI To provide customers with a powerful wafer testing service, according to 8 inch Wafer, the capacity is 40000 pieces per month.

The main test equipments : J750, D10, SC312, 3360D/P, DST1000, V50 and so on.

Main probe platform system configuration: PT301/302, JC8001, UF200SA, UF3000, P8 and so on.

Main wafer testing capability:

6 inch, 8 inch, 12 inch: logic chip wafer test, analog chip wafer test, mixed chip wafer test and SOC Test;

The power supply chip TRIM capability is provided;

Provide a wafer test mapping diagram for BIN definition function;

Provide photoelectric chip, CMOS SENSOR test capability.